PIC18F26Q10-E/SP | Roving Networks / Microchip Technology PIC18F26Q10-E/SP

PIC18F26Q10-E/SP

Panua

Kwa Marejeleo Pekee

Nambari ya Sehemu	PIC18F26Q10-E/SP
LIXINC Part #	PIC18F26Q10-E/SP
Mtengenezaji	Roving Networks / Microchip Technology
Kategoria	nyaya zilizounganishwa › iliyoingia - microcontrollers
Maelezo	IC MCU 8BIT 64KB FLASH 28SPDIP
Mzunguko wa maisha	Inayotumika
RoHS	Hakuna Taarifa za RoHS
EDA/CAD Models	PIC18F26Q10-E/SP Alama ya PCB na Alama
Maghala	Marekani, Ulaya, China, Hong Kong SAR
Uwasilishaji Unaokadiriwa	Nov 01 - Nov 05 2024(Chagua Usafirishaji wa Haraka)
Udhamini	Hadi mwaka 1 [Dhamana-Chache]*
Malipo
Usafirishaji

PIC18F26Q10-E/SP Vipimo

Nambari ya Sehemu:	PIC18F26Q10-E/SP
Chapa:	Roving Networks / Microchip Technology
Mzunguko wa maisha:	Active
RoHS:	Lead free / RoHS Compliant
Kategoria:	nyaya zilizounganishwa
Kitengo kidogo:	iliyoingia - microcontrollers
Mtengenezaji:	Roving Networks / Microchip Technology
mfululizo:	PIC® XLP™ 18Q, Functional Safety (FuSa)
kifurushi:	Tube
hali ya sehemu:	Active
processor ya msingi:	PIC
ukubwa wa msingi:	8-Bit
kasi:	64MHz
muunganisho:	I²C, LINbus, SPI, UART/USART
pembeni:	Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
idadi ya i/o:	25
saizi ya kumbukumbu ya programu:	64KB (64K x 8)
aina ya kumbukumbu ya programu:	FLASH
ukubwa wa eeprom:	1K x 8
saizi ya kondoo:	3.53K x 8
usambazaji wa voltage (vcc/vdd):	1.8V ~ 5.5V
data converters:	A/D 24x10b; D/A 1x5b
aina ya oscillator:	Internal
joto la uendeshaji:	-40°C ~ 125°C (TA)
aina ya ufungaji:	Through Hole
kifurushi / kesi:	28-DIP (0.300", 7.62mm)
kifurushi cha kifaa cha wasambazaji:	28-SPDIP