PIC18LF26J50-I/SP | Roving Networks / Microchip Technology PIC18LF26J50-I/SP | PIC18LF26J50-I/SP Inventory, Best Pricing

PIC18LF26J50-I/SP

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Nambari ya Sehemu	PIC18LF26J50-I/SP
LIXINC Part #	PIC18LF26J50-I/SP
Mtengenezaji	Roving Networks / Microchip Technology
Kategoria	nyaya zilizounganishwa › iliyoingia - microcontrollers
Maelezo	IC MCU 8BIT 64KB FLASH 28SPDIP
Mzunguko wa maisha	Inayotumika
RoHS	Hakuna Taarifa za RoHS
EDA/CAD Models	PIC18LF26J50-I/SP Alama ya PCB na Alama
Maghala	Marekani, Ulaya, China, Hong Kong SAR
Uwasilishaji Unaokadiriwa	Oct 26 - Oct 30 2024(Chagua Usafirishaji wa Haraka)
Udhamini	Hadi mwaka 1 [Dhamana-Chache]*
Malipo
Usafirishaji

PIC18LF26J50-I/SP Vipimo

Nambari ya Sehemu:	PIC18LF26J50-I/SP
Chapa:	Roving Networks / Microchip Technology
Mzunguko wa maisha:	Active
RoHS:	Lead free / RoHS Compliant
Kategoria:	nyaya zilizounganishwa
Kitengo kidogo:	iliyoingia - microcontrollers
Mtengenezaji:	Roving Networks / Microchip Technology
mfululizo:	PIC® XLP™ 18J
kifurushi:	Tube
hali ya sehemu:	Active
processor ya msingi:	PIC
ukubwa wa msingi:	8-Bit
kasi:	48MHz
muunganisho:	I²C, SPI, UART/USART, USB
pembeni:	Brown-out Detect/Reset, DMA, POR, PWM, WDT
idadi ya i/o:	16
saizi ya kumbukumbu ya programu:	64KB (32K x 16)
aina ya kumbukumbu ya programu:	FLASH
ukubwa wa eeprom:	-
saizi ya kondoo:	3.8K x 8
usambazaji wa voltage (vcc/vdd):	2V ~ 3.6V
data converters:	A/D 10x10b
aina ya oscillator:	Internal
joto la uendeshaji:	-40°C ~ 85°C (TA)
aina ya ufungaji:	Through Hole
kifurushi / kesi:	28-DIP (0.300", 7.62mm)
kifurushi cha kifaa cha wasambazaji:	28-SPDIP